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X Axis Cutting Range 260mm Wafer Dicing Machine Automatic Dicing Saw

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X Axis Cutting Range 260mm Wafer Dicing Machine Automatic Dicing Saw

Brand Name : GaNova

Place of Origin : Suzhou China

MOQ : 1

Delivery Time : 8-10week days

Product Name : DAD3350 Automatic Dicing Saw

Max. workpiece size : Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)

Application : 1.8 kW, 2.2 kW

Machine weight : Approx. 1,200kg

X-axis Cutting range : 260mm

X-axis Cutting speed : 0.1 ～ 600mm/s

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DAD3350 Wafer Dicing Machine Automatic Dicing Saw 1.8 kW, 2.2 kW

Process controls

Auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed to improve equipment productivity. In addition, the microscope includes an air blow mechanism and a lens shutter to prevent contamination. As an option, a low magnification microscope can be added for rough alignment. Through condition monitoring the processing conditions and various other statuses can be known at any given time. Advanced process control features can be added as options, including an on-screen cutting water management system for cutting water flow control.

Specifications

Specification

Unit

1.8 kW

2.2 kW

Max. workpiece size

-

Φ8 inch (250 mm × 250 mm, Φ300 mm user-specified specification)

X-axis

Cutting range

mm

260

Cutting speed

mm/s

0.1 ～ 600

Y-axis

Cutting range

mm

260

Index step

mm

0.0001

Index positioning accuracy

mm

0.002/260
(Single error) 0.002/5

Z-axis

Max. stroke

mm

32.2

31.4

Moving resolution

mm

0.00005

Repeatability accuracy

mm

0.001

θ-axis

Max. rotating angle

deg

380

Spindle

Rated torque

N・m

0.29

0.70

Revolution speed range

min‐1

6,000 ～ 60,000

3,000 ～ 30,000

Machine dimensions(W×D×H)

mm

900 × 1,050 × 1,800

Machine weight

kg

Approx. 1,200

* Product appearance, features, specifications, and other details may change due to technical modifications.
* Please read the standard specification sheet thoroughly before use.


Product Tags:

X Axis Wafer Dicing Machine

      

Wafer automatic dicing saw

      

Wafer Dicing Machine 260mm

      
Wholesale X Axis Cutting Range 260mm Wafer Dicing Machine Automatic Dicing Saw from china suppliers

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